Method of making a piezoelectric/electrostrictive film element with a diaphragm having at least one stress releasing end section
Patent 5940947 Issued on August 24, 1999. Estimated Expiration Date: 
January 21, 2018. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
January 21, 2018. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent References 2549872 3349259 3621154 3828210 Piezoelectric ceramic resonant transducer with stable frequency Single element transducer for an ink jet device Piezoelectric electro-acoustic transducer Thin flexible sintered structures Hermetically sealed electrostrictive actuator Piezoelectric/electrostrictive actuator having at least one piezoelectric/electrostrictive film InventorsAssigneeApplicationNo. 009943 filed on 01/21/1998US Classes:29/25.35, PIEZOELECTRIC DEVICE MAKING310/328With mechanical energy coupling meansExaminersPrimary: Hall, Carl E.Attorney, Agent or FirmForeign Patent References
International ClassH01L 041/22Foreign Application Priority Data1994-12-21 JPAbstractA piezoelectric and/or electrostrictive film element including a ceramic substrate, and a piezoelectric or electrostrictive unit formed on the substrate and including a piezoelectric or electrostrictive layer between lower and upper electrodes. The substrate has a window closed by a diaphragm portion. The unit is disposed on the diaphragm portion such that at least one of the opposite ends of the unit is spaced apart from the edge of the window in a direction toward the center of the diaphragm portion. The end part of the diaphragm portion spaced apart from the edge of the window is upwardly convexed or downwardly concaved to provide a stress releasing section for effectively converting stresses generated in the piezoelectric or electrostrictive unit into displacement of the diaphragm portion. Also disclosed are methods for forming the stress releasing section by firing the unfired piezoelectric/electrostrictive layer formed on the diaphragm portion of the fired ceramic substrate. | |
