Method of forming an ink-resistant seal between a printhead assembly and the headland region of an ink-jet pen cartridge.
June 23, 2017. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesDisposable ink jet head Method of preserving ink jet recording head Thermal ink jet common-slotted ink feed printhead Method of ultrasonically assembling workpieces Plastic substrate for thermal ink jet printer Offset nozzle droplet formation Attachment of a flexible circuit to an ink-jet pen Ink jet print head having two cured photoimaged barrier layers Ink delivery system for an inkjet printhead Method for aligning a substrate with respect to orifices in an inkjet printhead InventorsApplicationNo. 880972 filed on 06/23/1997US Classes:29/890.1Fluid pattern dispersing device making, e.g., ink jetExaminersPrimary: Young, LeeAssistant: Chang, Rick Kiltae Foreign Patent References
International ClassB41J 002/16AbstractA method of attaching an ink-jet printhead assembly to the headland region of an ink-jet pen cartridge to form a leak-proof seal without the use of any externally applied adhesive material. The cartridge includes a frame structure fabricated of a rigid plastic frame member formed of a first plastic material and a polymeric second material molded to the frame member. A headland region is defined at the tip of a snout region of the cartridge. An ink reservoir is connected through a standpipe defined by the rigid frame material with the headland region. The second plastic material defines a printhead assembly support structure which circumscribes a printhead and the stand-pipe. The printhead assembly is attached to the support structure after alignment by heatstaking the printhead assembly to the second plastic material defining the support structure. For an edge-fed printhead secured to a back surface of a flexible polymer tape, the support structure is a racetrack extending from a surface of the headland region, to which the back surface of the tape is heat staked. For a center-fed printhead die, the support structure is a pedestal surrounding the standpipe, to which the die is bonded by melting and reflowing the pedestal material.Other References
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