U.S. patents available from 1976 to present.
U.S. patent applications available from 2005 to present.

Integrated circuit transporting apparatus including a guide with an integrated circuit positioning function

Patent 5920192 Issued on July 6, 1999. Estimated Expiration Date: Icon_subject June 14, 2016. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Patent References

Die attach pickup tools
Patent #: 4875279
Issued on: 10/24/1989
Inventor: Sakiadis

Apparatus for testing IC elements
Patent #: 5151651
Issued on: 09/29/1992
Inventor: Shibata

IC test equipment
Patent #: 5172049
Issued on: 12/15/1992
Inventor: Kiyokawa, et al.

IC test equipment having a horizontally movable chuck carrier
Patent #: 5177434
Issued on: 01/05/1993
Inventor: Suzuki, et al.

Magnetic flux guide having tongues and magnetoresistive transducer incorporating said guide
Patent #: 5523687
Issued on: 06/04/1996
Inventor: Mouchot, et al.

Tester for integrated circuits Patent #: 5596282
Issued on: 01/21/1997
Inventor: Giddings, et al.

Inventor

Assignee

Application

No. 663682 filed on 06/14/1996

US Classes:

324/158.1MISCELLANEOUS

Examiners

Primary: Ballato, Josie
Assistant: Kobert, Russell M.

Attorney, Agent or Firm

Foreign Patent References

  • 39 12 590 A1 DE. 10/24/1990

International Class

G01R 001/04

Foreign Application Priority Data

1995-07-03 JP

Abstract

A low cost IC transporting apparatus locates a semiconductor device at an accurate position, picks up the semi-conductor device by suction, and transports the semiconductor device. A play is provided in a positioning recessed portion having upwardly inclined surfaces so that a semiconductor device fallen into the positioning recessed portion can move in a horizontal direction. A guide surrounds a device suction unit picking up by suction the semiconductor device fallen into the positioning recessed portion. The guide guides the device suction unit to pick up by suction the semiconductor device at a predetermined suction position. Downwardly projected ridged portions are provided on the lower end of the guide, each of which includes a shape conforming to a corresponding one of the upwardly inclined surfaces of the positioning recessed portion. The guide also includes flat portions provided at the base portion of the ridged portions thereof. The flat portions abut against an upper end surface of the positioning recessed portion when the ridged portions of the guide engage with the upwardly inclined surfaces of the positioning recessed portion without any play therebetween.

Other References

  • Search and Examiner Report in corresponding Singapore Patent Application No. 9610392-4 (Austrian Patent Office Search and Examination Report, for Patent Application 9610392-4, filed Jul. 31, 1996)
  • Translation of an Official Letter Dated 26th Nov. 1997 from the German Patent Office; Re: German Patent Application No. 196 26 611.4-3
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