Potable water supply components
Patent 5919519 Issued on July 6, 1999. Estimated Expiration Date: 
July 6, 2016. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
July 6, 2016. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent References 2711391 2834659 3420715 3879231 Method of improving corrosion resistance of lead and lead alloy coated metal Phosphatization of steel surfaces and metal-coated surfaces Monofluorophosphate solubility inhibitor for lead in potable water sources Patent #: 5076941 InventorAssigneeApplicationNo. 443268 filed on 05/17/1995US Classes:427/239, Metal base138/145, Coated148/253, Contains phosphorus148/254, Liquid composition applied prior to reaction of metal substrate with phosphorus (e.g., cleaning, activating, etc.)148/282, Metal substrate contains elemental copper or alloy thereof427/318, Metal base427/399BASE SUPPLIED CONSTITUENTExaminersPrimary: Bell, JanyceAttorney, Agent or FirmForeign Patent References
International ClassesB05D 007/22C23C 008/06 Foreign Application Priority Data1994-05-17 GBAbstractA method of treating a potable water supply component, for example a pipe, pipe coupling or tap body, made of a leaded copper-based alloy such as a brass or gun metal, in order to inhibit the leach out of lead from the alloy by potable water during service, comprises treating at least internal surfaces of the component with an aqueous solution of an acid that forms a substantially water insoluble compound with lead. The acid is preferably ortho-phosphoric acid.Other References
Field of SearchMetal baseMetal base BASE SUPPLIED CONSTITUENT Metal substrate contains elemental copper or alloy thereof Contains phosphorus Liquid composition applied prior to reaction of metal substrate with phosphorus (e.g., cleaning, activating, etc.) Coated Multilayer (continuous layer) Elemental metal containing Single layer (continuous layer) Phosphorus containing metal salt formed in situ | |
