U.S. patents available from 1976 to present.
U.S. patent applications available from 2005 to present.

Integrated released beam, thermo-mechanical sensor for sensing temperature variations and associated methods

Patent 5917226 Issued on June 29, 1999. Estimated Expiration Date: Icon_subject October 24, 2017. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Patent References

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Semiconductor acceleration sensor and vehicle control system using the same
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Inventors

Assignee

Application

No. 957802 filed on 10/24/1997

US Classes:

257/415, Physical deformation257/467, Temperature374/187Mechanical (e.g., expansion or contraction of materials)

Examiners

Primary: Chaudhuri, Olik
Assistant: Wille, Douglas A.

Attorney, Agent or Firm

International Class

H01L 029/82

Abstract

An integrated circuit and method are provided for sensing activity such as temperature variations in a surrounding environment. The integrated released beam sensor preferably includes a switch detecting circuit region and a sensor switching region connected to the switch detecting circuit region. The sensor switching region preferably includes a fixed contact layer, a sacrificial layer on the fixed contact layer, and a floating contact on the sacrificial layer and having portions thereof overlying the fixed contact layer in spaced relation therefrom in an open switch position and extending lengthwise generally transverse to a predetermined direction. The floating contact preferably includes at least two layers of material. Each of the at least two layers have a different thermal expansion coefficient so that the floating contact displaces in the predetermined direction responsive to a predetermined temperature variation so as to contact the fixed contact layer and thereby form a closed switch position. The methods of forming an integrated sensor advantageously are preferably compatible with known integrated circuit manufacturing processes, such as for CMOS circuit manufacturing, with only slight variations therefrom.

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