Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs
June 6, 2017. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesDefect-recognition processing apparatus Process control interface system for managing measurement data Semiconductor integrated circuit chip having an identification circuit therein Method for producing semiconductor devices Methods of forming and inspecting semiconductor device patterns Method for manufacturing a semiconductor device including wafer aging, probe inspection, and feeding back the results of the inspection to the device fabrication process Data analysis system and method for industrial process control systems Method and apparatus for detecting defect on semiconductor substrate surface PROM for integrated circuit identification and testing Semiconductor device having identification region for carrying out failure analysis Inventors
ApplicationNo. 871015 filed on 06/06/1997US Classes:700/121, Integrated circuit production or semiconductor fabrication700/116, Having identification controlled manufacturing operation702/117Of circuitExaminersPrimary: Grant, WilliamAssistant: Garland, Steven R. Attorney, Agent or FirmForeign Patent References
International ClassG06F 019/00AbstractAn inventive method in an integrated circuit (IC) manufacturing process for using data regarding repair procedures conducted on IC's at probe to determine whether any further repairs will be conducted later in the manufacturing process includes storing the data in association with a fuse ID of each of the IC's. The ID codes of the IC's are automatically read, for example, at an opens/shorts test during the manufacturing process. The data stored in association with the ID codes of the IC's is then accessed, and additional repair procedures the IC's may undergo are selected in accordance with the accessed data. Thus, for example, the accessed data may indicate that an IC is unrepairable, so the IC can proceed directly to a scrap bin without having to be queried to determine whether it is repairable, as is necessary in traditional IC manufacturing processes.Field of SearchREPAIR OR RESTORATIONUtilizing integral test element Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor Optical characteristic sensed Electrical characteristic sensed WITH MEASURING OR TESTING Electrical characteristic sensed MISCELLANEOUS PLURAL, AUTOMATICALLY SEQUENTIAL TESTS Of circuit | |
