Emulative lid/heatspreader for processor die attached to an organic substrate
Patent 5903436 Issued on May 11, 1999. Estimated Expiration Date: 
December 30, 2017. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
December 30, 2017. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesMethod of self-packaging an IC chip High thermal emissive semiconductor device package Patent #: 5552635 InventorsApplicationNo. 001247 filed on 12/30/1997US Classes:361/704, Thermal conduction165/80.2, Electrical component165/80.3, Air cooled, including fins257/706, With heat sink257/717, Isolation of cooling means (e.g., heat sink) by an electrically insulating element (e.g., spacer)257/E23.09, Auxiliary members in containers characterized by their shape, e.g., pistons (EPO)361/707, Through support means361/708, Specific chemical compound or element361/713, Electrically insulating thermally conductive361/717, For active solid state devices361/718For integrated circuitExaminersPrimary: Picard, Leo P.Assistant: Chervinsky, Boris Attorney, Agent or FirmInternational ClassH05K 7/2/0AbstractA method and apparatus for making the weight load distribution more uniform over the surface of a processor die and improving the heat transfer between the processor die and a thermal spreader cap is provided. The apparatus includes generally a square-like box shaped thermal spreader cap having a cavity that conforms to the shape of the processor die. The thermal spreader cap fits over the processor die and has a cavity that is dome-like in shape. Additionally, the thermal spreader cap is attached to a thermal dissipative device which may in turn be connected to a heat sink. The apparatus provides a thinner and more uniform thermal interface layer between the processor die and the thermal spreader cap, thereby evening the weight load on the surface of the processor die and improving the heat flux between the processor die and the thermal spreader cap.Field of SearchThermal conductionThrough component housing For active solid state devices For integrated circuit Circuit board mounted With heat sink Isolation of cooling means (e.g., heat sink) by an electrically insulating element (e.g., spacer) Heat dissipating element held in place by clamping or spring means Pressed against semiconductor element Heat dissipating element has high thermal conductivity insert (e.g., copper slug in aluminum heat sink) With heat sink embedded in encapsulant With heat sink Electrical component Air cooled, including fins Cooling electrical device | |
