U.S. patents available from 1976 to present.
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Diffusion-barrier materials for thick-film piezoresistors and sensors formed therewith

Patent 5898359 Issued on April 27, 1999. Estimated Expiration Date: Icon_subject December 19, 2017. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Patent References

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Patent #: 5295395
Issued on: 03/22/1994
Inventor: Hocker, et al.

Force sensor
Patent #: 5353003
Issued on: 10/04/1994
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Method for forming thick film resistors and compositions therefor Patent #: 5463367
Issued on: 10/31/1995
Inventor: Ellis

Inventor

Assignee

Application

No. 994113 filed on 12/19/1997

US Classes:

338/47, Force-actuated338/2, STRAIN GAUGE TYPE338/13, RESISTANCE VALUE RESPONSIVE TO A CONDITION338/42Diaphragm

Examiners

Primary: Gellner, Michael L.
Assistant: Lee, Richard

Attorney, Agent or Firm

International Class

H01C 010/10

Abstract

A thick-film strain-sensing structure for a media-compatible, high-pressure sensor. The strain-sensing structure generally includes a metal diaphragm, at least one electrical-insulating layer on the diaphragm, an interface layer on the electrical-insulating layer, and at least one thick-film piezoresistor on the interface layer for sensing deflection of the diaphragm. The interface layer and the electrical-insulating layers are preferably formed by thick-film processing, as done for the piezoresistors. For compatibility with the metal diaphragm, the electrical-insulating layer has a CTE near that of the diaphragm. The interface layer is formulated to inhibit and control diffusion of the electrical-insulating layers into the piezoresistors. For this purpose, the interface layer is formed from a composition that contains, in addition to a suitable organic media, alumina, zinc oxide, and at least one glass frit mixture comprising lead oxide, a source of boron oxide such as boric acid, silica and alumina. Additional constituents of the interface layer preferably include titania, cupric oxide, manganese carbonate as a source for manganese monoxide, and cobalt carbonate as a source of cobalt oxide.

Other References

  • White, An Assessment of Thick-Film Piezoresistors on Insulated Steel Substrates, Hybrid Circuits, No. 20, (Sep. 1989), pp. 23-27
  • Electro-Science Laboratories, Inc., Application Notes for Thick Film Heaters Made from Dielectric Tape Bonded Stainless Steel Substrates, (1994)
  • Stein et al., Thick Film Heaters Made From Dielectric Tape Bonded Stainless Steel Substrates, ISHM '95 Proceedings, Boston MA (1994), pp. 125-129
  • Wahlers et al., Dielectric Tape Bonded Stainless Steel Substrates for High Power Packages, Hybrid Circuitry and Heater Uses, (1994)
  • Chitale et al., High Gauge Factor Thick Film Resistors for Strain Gauges, Hybrid Circuit Technology, (May 1989)
  • Chitale et al., Piezoresistivity in High GF Thick Film Resistors: Sensor Design and Very Thin YSZ Substrates, Proceedings 7th IM Conference, Yokohama, Japan (Jun. 1992). pp. 561-570
  • Moriwaki et al., Interactions Between Thick Film Resistors and Alumina Substrate, Proceedings 7th IM Conference, Yokohama, Japan (Jun. 1992)
  • Prabhu et al., Interactions Between Base Metal Thick Film Inks and High Temperature Porcelain-Coated Steel Substrates, ISHM Symposium, Chicago IL (Oct. 1994), pp.331-34
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