Patent ReferencesStress sensor apparatus Thermally compensated silicon pressure sensor Thick film conductor compositions Piezoresistive pressure sensor Zinc oxide varistor structure Single diaphragm transducer with multiple sensing elements Thick film conductor compositions for use with an aluminum nitride substrate Diaphragm-based-sensors Force sensor Method for forming thick film resistors and compositions therefor Patent #: 5463367 InventorAssigneeApplicationNo. 994113 filed on 12/19/1997US Classes:338/47, Force-actuated338/2, STRAIN GAUGE TYPE338/13, RESISTANCE VALUE RESPONSIVE TO A CONDITION338/42DiaphragmExaminersPrimary: Gellner, Michael L.Assistant: Lee, Richard Attorney, Agent or FirmInternational ClassH01C 010/10AbstractA thick-film strain-sensing structure for a media-compatible, high-pressure sensor. The strain-sensing structure generally includes a metal diaphragm, at least one electrical-insulating layer on the diaphragm, an interface layer on the electrical-insulating layer, and at least one thick-film piezoresistor on the interface layer for sensing deflection of the diaphragm. The interface layer and the electrical-insulating layers are preferably formed by thick-film processing, as done for the piezoresistors. For compatibility with the metal diaphragm, the electrical-insulating layer has a CTE near that of the diaphragm. The interface layer is formulated to inhibit and control diffusion of the electrical-insulating layers into the piezoresistors. For this purpose, the interface layer is formed from a composition that contains, in addition to a suitable organic media, alumina, zinc oxide, and at least one glass frit mixture comprising lead oxide, a source of boron oxide such as boric acid, silica and alumina. Additional constituents of the interface layer preferably include titania, cupric oxide, manganese carbonate as a source for manganese monoxide, and cobalt carbonate as a source of cobalt oxide.Other References
| |