Method for encapsulating an integrated semi-conductor circuit
Patent 5897338 Issued on April 27, 1999. Estimated Expiration Date: 
June 10, 2017. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
June 10, 2017. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesSemiconductor device having a light transparent window and a method of producing same Method of making homogeneous thermoplastic semi-conductor chip carrier package Patent #: 5483740 InventorAssigneeApplicationNo. 871960 filed on 06/10/1997US Classes:438/116, Having light transmissive window216/33, ADHESIVE OR AUTOGENOUS BONDING OF TWO OR MORE SELF-SUSTAINING PREFORMS WHEREIN AT LEAST TWO OF THE PREFORMS ARE NOT INTENDED TO BE REMOVED (E.G., PREFABRICATED BASE, ETC.)257/E21.504, Moulds (EPO)257/E23.124, Device being completely enclosed (EPO)438/123, Lead frame438/127EncapsulatingExaminersPrimary: Powell, William A.Attorney, Agent or FirmForeign Patent References
International ClassH01L 021/00Foreign Application Priority Data1996-06-11 NLAbstractMethod for encapsulating an integrated semi-conductor circuit (die) comprising the following steps:a) mounting the semi-conductor circuit onto the surface of a so-called lead frame,b) attaching connecting wires between the contact surfaces of the semi-conductor circuit and selected parts of the lead frame (bonding operation),c) by means of a mould producing a plastic housing which at least encapsulates the semi-conductor circuit, the supporting surface, the bonding wires and part of the lead frame,d) the mould comprises an inwards extending section of which the end surface in the closed situation of the mould extends parallel to the free upper side of the integrated semi-conductor circuit at short distance thereof, ande) before closing the mould a layer of heat resistant deformable material in the form of a ring or a continuous layer is brought in between the upper side of the integrated semi-conductor circuit and said end surface of the inwards extending part, which layer not or hardly adheres to the plastic housing.Field of SearchHaving light transmissive windowIncluding adhesive bonding step Lead frame And encapsulating Encapsulating ENCAPSULATED ADHESIVE OR AUTOGENOUS BONDING OF TWO OR MORE SELF-SUSTAINING PREFORMS WHEREIN AT LEAST TWO OF THE PREFORMS ARE NOT INTENDED TO BE REMOVED (E.G., PREFABRICATED BASE, ETC.) | |
