Polishing pad with uniform abrasion
Polishing pad with controlled abrasion rate
Polishing pads used to chemical-mechanical polish a semiconductor substrate
Semiconductor polishing pad
Optical end point detection methods in semiconductor planarizing polishing processes
In-situ endpoint detection and process monitoring method and apparatus for chemical-mechanical polishing
Polishing pads Patent #: 5605760
ApplicationNo. 689930 filed on 08/16/1996
US Classes:451/526, FLEXIBLE-MEMBER TOOL, PER SE451/283, Work rotating451/285, Rotary work holder451/287Planar surface abrading
ExaminersPrimary: Scherbel, David A.
Assistant: Banks, Derris H.
Attorney, Agent or Firm
Foreign Patent References
International ClassB24D 011/00
AbstractThe polishing pad for a chemical mechanical polishing apparatus and a method of making the same. The polishing pad has a covering lawyer with a polishing surface and a backing layer which is adjacent to the platen. A first opening in the covering layer with a first cross-sectional area and a second opening in the backing layer with a second, different cross-sectional area form an aperture through the polishing pad. A substantially transparent polyurethane plug is positioned in the aperture, and an adhesive material fixes the plug in the aperture.
Field of SearchFLEXIBLE-MEMBER TOOL, PER SE
Rotary work holder
By means loosely confining work
Planar surface abrading
Having pressure plate
Having vacuum or adhesive securing means
By optical sensor
TOOL SUPPORT FOR FLEXIBLE-MEMBER TOOL
Of tool or work holder position