Monitoring deposited pads
Patent 5882720 Issued on March 16, 1999. Estimated Expiration Date: 
August 8, 2017. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
August 8, 2017. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesMethod and apparatus for inspecting articles Method of visualizing minute particles Apparatus and method for automatic monitoring and control of a soldering process Method of making solder balls by contained paste deposition Patent #: 5586715 InventorsAssigneeApplicationNo. 908770 filed on 08/08/1997US Classes:427/8, MEASURING, TESTING, OR INDICATING228/8, WITH CONTROL MEANS RESPONSIVE TO SENSED CONDITION228/102, With condition responsive, program, or timing control228/105, Using optical viewing means (e.g., microscope)356/613, Silhouette427/10, Electrical or optical427/97.7Coating hole wallExaminersPrimary: Lusignan, Michael R.Attorney, Agent or FirmInternational ClassB05B 005/12AbstractAutomatically monitoring pads of material deposited on a surface of a workpiece using an inspection system that senses a deposited pad of material and determines pad height values at a plurality of locations across the pad, and a shape classifier that receives the pad height values as inputs and outputs a plurality of three-dimensional shape attributes related to pad deposit conditions. | |
