ApplicationNo. 753018 filed on 11/19/1996
US Classes:228/205, Cleaning228/180.22, Lead-less (or "bumped") device228/207, Applying flux257/E21.503, Encapsulation of active face of flip chip device, e.g., under filling or under encapsulation of flip-chip, encapsulation perform on chip or mounting substrate (EPO)257/E21.508Forming solder bumps (EPO)
ExaminersPrimary: Heinrich, Samuel M.
Attorney, Agent or Firm
Foreign Patent References
International ClassesH01L 021/60
Foreign Application Priority Data1990-02-19 JP
AbstractIn soldering together two members such as electronic circuit devices, after an oxide or contaminated layer has been removed from the surface of a solder material or bonding pad, for example, the members are aligned in an oxidizing atmosphere. Then the solder material is heated in a nonoxidizing atmosphere to melt the solder and bond the members. Cleaning of the solder material or bonding pad is performed by sputter-cleaning, laser cleaning, mechanical polishing, or cutting.