Flexible electrical connection and method of making same
Flexible printed circuit connecting means for at least one hybrid circuit structure and a printed circuit board
Electronic package and method of making same
Techniques for providing high I/O count connections to semiconductor dies
Multichip packaged semiconductor device and method for manufacturing the same
Integrated circuit package with direct access to internal signals
Electrical interconnect assembly
Flexible substrate folded in a U-shape with a rigidizer plate located in the notch of the U-shape
Tab grid array
ApplicationNo. 028014 filed on 02/23/1998
US Classes:438/123, Lead frame257/E23.004, Characterized by shape (EPO)257/E23.055, Consisting of thin flexible metallic tape with or without film carrier (EPO)257/E23.069, Spherical bumps on substrate for external connection, e.g., ball grid arrays (BGA) (EPO)257/E23.135, Fillings or auxiliary members in containers or encapsulations, e.g., centering rings (EPO)438/125Insulative housing or support
ExaminersPrimary: Picardat, Kevin M.
Attorney, Agent or Firm
Foreign Patent References
International ClassH01L 021/44
AbstractAn electronic package which includes a flexible substrate, stiffener and chip. The chip is bonded to the substrate, which was secured to the stiffener. Strain relief means are utilized at various locations in the package to prevent problems (e.g., tape "wrinkling") associated with relatively large differences in coefficients of thermal expansion between the package's various elements.