Electronic package with strain relief means and method of making
February 23, 2018. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesFlexible electrical connection and method of making same Semiconductor device Flexible printed circuit connecting means for at least one hybrid circuit structure and a printed circuit board Electronic package and method of making same Techniques for providing high I/O count connections to semiconductor dies Multichip packaged semiconductor device and method for manufacturing the same Integrated circuit package with direct access to internal signals Electrical interconnect assembly Flexible substrate folded in a U-shape with a rigidizer plate located in the notch of the U-shape Tab grid array InventorsApplicationNo. 028014 filed on 02/23/1998US Classes:438/123, Lead frame257/E23.004, Characterized by shape (EPO)257/E23.055, Consisting of thin flexible metallic tape with or without film carrier (EPO)257/E23.069, Spherical bumps on substrate for external connection, e.g., ball grid arrays (BGA) (EPO)257/E23.135, Fillings or auxiliary members in containers or encapsulations, e.g., centering rings (EPO)438/125Insulative housing or supportExaminersPrimary: Picardat, Kevin M.Attorney, Agent or FirmForeign Patent References
International ClassH01L 021/44AbstractAn electronic package which includes a flexible substrate, stiffener and chip. The chip is bonded to the substrate, which was secured to the stiffener. Strain relief means are utilized at various locations in the package to prevent problems (e.g., tape "wrinkling") associated with relatively large differences in coefficients of thermal expansion between the package's various elements. | |
