Lead-free, high tin ternary solder alloy of tin, silver, and indium

Patent 5874043 Issued on February 23, 1999. Estimated Expiration Date:

December 17, 2016. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Abstract Claims Description Full Text

Patent References

Soft-solder alloy for bonding ceramic articles
Patent #: 4797328
Issued on: 01/10/1989
Inventor: Boehm , et al.

Lead-free alloy containing tin, silver and indium
Patent #: 5256370
Issued on: 10/26/1993
Inventor: Slattery, et al.

Lead-free, high temperature, tin based multi-component solder Patent #: 5328660
Issued on: 07/12/1994
Inventor: Gonya, et al.

Inventors

Application

No. 768907 filed on 12/17/1996

US Classes:

420/557, TIN BASE420/560, Copper containing420/561, Antimony, or bismuth containing420/562Antimony, or bismuth containing

Examiners

Primary: Ip, Sikyin

Attorney, Agent or Firm

Meller; Michael N.

Foreign Patent References

0 612 578 EP. 08/13/1994
06269982 JP. 09/13/1994
9418350 WO. 08/13/1994

International Class

C22C 013/00

Abstract

A high solidus temperature, high service temperature, high strength ternary solder alloy, solder paste and method. The alloy contains a major proportion of tin of at least about 70% by weight, a selectively limited amount of silver from about 6.5 to about 7.5% by weight, balance indium.