U.S. patents available from 1976 to present.
U.S. patent applications available from 2005 to present.

Release composition

Patent 5866261 Issued on February 2, 1999. Estimated Expiration Date: Icon_subject December 20, 2016. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Patent References

Silicone epoxy curable compositions
Patent #: 4082719
Issued on: 04/04/1978
Inventor: Liles, et al.

Curable two-part silicone rubber compositions with improved adhesion properties
Patent #: 4157357
Issued on: 06/05/1979
Inventor: Mine ,   et al.

Polyorganosiloxane compositions for surface treatment
Patent #: 4652618
Issued on: 03/24/1987
Inventor: Sumida ,   et al.

Platinum catalyzed heterocyclic compound compositions
Patent #: 5128431
Issued on: 07/07/1992
Inventor: Riding, et al.

Method of using epoxysilicone controlled release composition Patent #: 5279860
Issued on: 01/18/1994
Inventor: Griswold, et al.

Inventors

Assignee

Application

No. 772342 filed on 12/20/1996

US Classes:

428/447, As siloxane, silicone or silane522/31, Specified rate-affecting material contains onium group522/53, Hetero sulfur ring522/148, Processes of treating a solid polymer or SICP derived from silicon containing reactant; or compositions therefore525/476, Mixed with reactant containing more than one 1,2-epoxy group per mole or polymer derived therefrom525/478, Wherein one of said silicon materials contains Si-H bond528/31Silicon reactant contains a silicon-to-hydrogen bond

Examiners

Primary: Glass, Margaret W.

Attorney, Agent or Firm

International Class

B32B 009/04

Abstract

A composition of matter comprising:(a) about 60 to about 99 parts by weight of a curable epoxypolyorganosiloxane;(b) about 1 to about 40 parts by weight of a crosslinkable silicone hydride resin having no epoxy functionality; and(c) about 0.1 to about 5 parts by weight of an curing agent, which, upon exposure to actinic radiation is capable of curing components (a) and (b);wherein the total amount of components (a) and (b) is 100 parts by weight and wherein said composition demonstrates surface release properties when coated and cured onto a substrate is provided. The composition is particularly useful in articles of manufacture where release properties are desired.

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