Method and apparatus for controlling the temperature of reaction chamber walls
April 8, 2017. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesPlanar reactive evaporation method for the deposition of compound semiconducting films Transfer and temperature monitoring apparatus Epitaxial growing apparatus Method for increasing the batch size of a barrel epitaxial reactor and reactor produced thereby Heat treating apparatus with cooling fluid nozzles Double-dome reactor for semiconductor processing In-situ measurement of a thin film deposited on a wafer Apparatus and method for determining wafer temperature using pyrometry Device for thermal treatment and film forming process Patent #: 5346555 InventorsApplicationNo. 831797 filed on 04/08/1997US Classes:118/666, Temperature responsive118/724, By means to heat or cool118/725, Substrate heater216/59, With measuring, testing, or inspecting216/60, By optical means or of an optical property216/61, By electrical means or of an electrical property422/202, Heat-exchange jacket surrounding reaction chamber427/8, MEASURING, TESTING, OR INDICATING427/248.1COATING BY VAPOR, GAS, OR SMOKEExaminersPrimary: Beck, ShriveAssistant: Meeks, Timothy Foreign Patent References
International ClassC23C 016/52AbstractAn apparatus and a concomitant method for controlling coolant (air) flow proximate a reaction chamber within a workpiece processing system such that the temperature of a wall of the reaction chamber is maintained at a predefined target temperature. The target temperature is typically a temperature that optimizes a process concurrently being accomplished within the chamber, e.g., utilizing one temperature during deposition processes and a different temperature during cleaning processes. The apparatus contains a temperature measuring device to measure the temperature of the chamber wall. The measured temperature is compared to the predefined target temperature. A closed loop system controls the air flow proximate the chamber walls such that the measured temperature becomes substantially equal to the target temperature. Air flow control is provided by an air flow control device located within an inlet conduit that supplies air to a shroud for channeling the air past the reaction chamber. The shroud forms a portion of a housing which supports and encloses the reaction chamber.Other References
Field of SearchMEASURING, TESTING, OR INDICATINGCOATING BY VAPOR, GAS, OR SMOKE Temperature responsive By means to heat or cool Substrate heater With measuring, testing, or inspecting By optical means or of an optical property By electrical means or of an electrical property Heat-exchange jacket surrounding reaction chamber With responsive control | |
