Semiconductor wafer polishing machine and wafer carrier therefor
Bearing mount for lapping machine pressure plate
Apparatus for mechanically clamping semiconductor wafer against pliable thermally conductive surface
Apparatus for improving flatness of polished wafers
Automatic wafer focusing and flattening system
ApplicationNo. 900812 filed on 07/25/1997
US Classes:451/9, Of tool or work holder position451/6, By optical sensor451/10, And feeding of tool or work holder451/41, Glass or stone abrading451/288Having pressure plate
ExaminersPrimary: Rose, Robert A.
Assistant: Nguyen, George
Attorney, Agent or Firm
Foreign Patent References
International ClassB24B 049/04
AbstractA method and apparatus is disclosed for polishing the face of a semiconductor wafer. The wafer is held in position by a tooling head and is contacted by an abrasive pad. A table is provided on to which the abrasive pad is fixedly attached, both of which move in directions parallel to the face of the wafer being polished. A controller controls the motion of the table according to a predetermined polishing pattern and is capable of maintaining a constant velocity between the wafer and the abrasive pad. The tooling head includes a circular platen and a retention ring peripherally oriented about the outer edge of the platen which resists lateral forces on the wafer caused by engagement of the face of the wafer with the polishing surface. An adjustable coupling is mounted to the platen and the ring, and serves to adjustably position during polishing the height of the ring relative to the face of the wafer as well as to rigidly support during polishing the position of the retaining ring. A flexible disk is fixedly mounted between a support post and the platen and oriented substantially parallel to the face of the platen. The flexible disk is adapted to prevent rotation of the platen about the axis of the support post and to transmit forces between the platen and the post in directions parallel to the face of the platen.