Electronic assembly with porous heat exchanger and orifice plate
January 27, 2017. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesSemiconductor cooling apparatus High density electronics package having stacked circuit boards Three-dimensional multi-chip module Very high temperature heat exchanger Polycrystalline diamond heat sink having major surfaces electrically insulated from each other Ceramic-metal composite structure and process of producing same Stacking of three dimensional high density interconnect modules with metal edge contacts Patent #: 5699234 InventorsAssigneeApplicationNo. 789678 filed on 01/27/1997US Classes:361/696, With heat exchanger unit165/80.3, Air cooled, including fins165/907, POROUS361/708Specific chemical compound or elementExaminersPrimary: Tolin, Gerald P.Attorney, Agent or FirmForeign Patent References
International ClassH05K 007/20AbstractAn electronic substrate is formed of a porous planar heat exchanger and an orifice plate overlying and thermally contacting the heat exchanger. The orifice plate has a plurality of apertures therethrough. An electronic device is mounted to the orifice plate. A coolant such as air or other gas is forced through the heat exchanger and the apertures of the orifice plate to remove heat that is generated by the electronic device. Preferably, at least two of the assemblies formed of the substrate and the mounted electronic device are mounted in a facing relationship to form a multichip module. A housing is provided to support the assemblies and to channel the flow of coolant through the substrates. Electrical interconnection between the components is provided by a peripheral ring with electrically conducting paths therethrough, which ring extends between the facing substrates.Field of SearchHaving composition, density, or hardness gradientPorous (e.g., foamed, spongy, cracked, etc.) Laterally noncoextensive components (e.g., embedded, etc.) Semiconductor component W-base component Air cooled, including fins Liquid cooled HEAT TRANSMITTER Cooling electrical device POROUS With electrical component cooling With cooling means With heat sink With provision for cooling the housing or its contents For integrated circuit Liquid coolant With gas coolant With fins For plural devices With discrete components With electrical isolation means Air Pressurized or conditioned Plural Openings Circular With air circulating means Fan or blower With heat exchanger unit With heat exchanger unit Details Thermal conduction By specific coating Containing silicon or aluminum Through support means Specific chemical compound or element Electrically insulating thermally conductive For module Plural For active solid state devices For integrated circuit Circuit board mounted For printed circuit board Plural For electronic circuit Plural With housing Selective connections Stacked With housing or chassis With housing or chassis Interconnection details Plural With separable connector or socket means Stacked | |
