Lead-free soldering material having superior solderability
Patent 5843371 Issued on December 1, 1998. Estimated Expiration Date: 
October 11, 2015. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
October 11, 2015. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesLead-free alloy containing tin, silver and indium Patent #: 5256370 InventorsAssigneeApplicationNo. 540694 filed on 10/11/1995US Classes:420/562, Antimony, or bismuth containing148/22, COMPOSITIONS148/23FluxingExaminersPrimary: Ip, SikyinAttorney, Agent or FirmForeign Patent References
International ClassesC22C 013/00B23K 035/26 Foreign Application Priority Data1995-06-30 KRAbstractA lead-free soldering material for soldering wires of electronic parts is disclosed. The lead-free soldering material is composed of in weight %: 3-4% of Ag, 2-5% of In, 6-14% of Bi and a balance of Sn, and the soldering material shows a superior solderability.Other References
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