Radio frequency identification card and hot lamination process for the manufacture of radio frequency identification cards
October 7, 2016. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesIdentification card with an IC-module and method for producing it Method of manufacturing an electronic identification card Data carrier having an integrated circuit and method for producing same Personal memory card having a contactless interface using differential data transfer Flexible printed circuit IC package and IC card incorporating the same thereinto Electronic microcircuit card and method for its manufacture Molded IC card IC card and a method for the manufacture of the same Data communication receiver utilizing a loop antenna having a hinged connection InventorApplicationNo. 727789 filed on 10/07/1996US Classes:156/298, Embedding of laminae within face of additional laminae156/312Sequential different pressure applyingExaminersPrimary: Lorin, Francis J.Attorney, Agent or FirmInternational ClassB32B 031/20AbstractA plastic card, such as a radio frequency identification card, including at least one electronic element embedded therein and a hot lamination process for the manufacture of radio frequency identification cards and other plastic cards including a micro-chip embedded therein. The process results in a card having an overall thickness in the range of 0.028 inches to 0.032 inches with a surface suitable for receiving dye sublimation printing--the variation in card thickness across the surface is less than 0.0005 inches. A card manufactured in accordance with the present invention also complies with all industry standards and specifications. Also, the hot lamination process of the present invention results in an aesthetically pleasing card. The invention also relates to a plastic card formed in accordance with the hot lamination process of the present invention. | |
