Thin radio frequency transponder with leadframe antenna structure

Patent 5786626 Issued on July 28, 1998. Estimated Expiration Date:

March 25, 2016. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Abstract Claims Description Full Text

Patent References

Radio frequency circuit and memory in thin flexible package Patent #: 5528222
Issued on: 06/18/1996
Inventor: Moskowitz, et al.

Inventors

Assignee

IBM Corporation

Application

No. 621784 filed on 03/25/1996

US Classes:

257/673, With bumps on ends of lead fingers to connect to semiconductor257/666, LEAD FRAME257/674, With means for controlling lead tension257/735, Beam leads (i.e., leads that extend beyond the ends or sides of a chip component)257/737, Bump leads257/E23.031, Lead frames or other flat leads (EPO)257/E23.119, Organic, e.g., plastic, epoxy (EPO)257/E23.126, Double encapsulation or coating and encapsulation (EPO)343/873, Antenna embedded, potted, or coated439/916ANTENNA

Examiners

Primary: Arroyo, Teresa M.

Attorney, Agent or Firm

Percello; Louis J.

Foreign Patent References

0481776 EP. 04/13/1992
0595549 EP. 05/13/1994
4319878 DE. 12/13/1993
9119302 WO. 12/13/1991
3903551 WO. 05/13/1993
9411846 WO. 05/13/1994

International Classes

H01L 023/495
H01L 023/48
H01L 023/52
H01L 029/40

Abstract

A novel radio frequency transponder (tag) with a minimum of components and connects is thin and flexible because these components and connects can be unsupported by a substrate layer. This is accomplished by using a conducting leadframe structure not only as a connection medium but also as a circuit element, i.e., the transponder antenna. In various preferred embodiments, the leadframe is mechanically positioned and fixably attached to a circuit chip so that the leadframe (antenna) is self supporting. A protective coating can be added where the leadframe is attached to the circuit chip. Further a protective surrounding can envelops the entire leadframe antenna, circuit chip, and, if provided, the protective coating.