Polish pad conditioner with radial compensation
September 18, 2015. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesMethod for conditioning the surface of a polishing pad Polishing pad conditioning apparatus for wafer planarization process Conditioner for a polishing pad and method therefor Preconditioner for a polishing pad and method for using the same Application of semiconductor IC fabrication techniques to the manufacturing of a conditioning head for pad conditioning during chemical-mechanical polish Method and apparatus for conditioning of chemical-mechanical polishing pads Surface treatment of polishing cloth Patent #: 5626509 InventorsApplicationNo. 529823 filed on 09/18/1995US Classes:451/288, Having pressure plate451/41, Glass or stone abrading451/56, With tool treating or forming451/285, Rotary work holder451/286, By means loosely confining work451/287, Planar surface abrading451/289, Having vacuum or adhesive securing means451/443, Dressing451/444, Tool cleaner451/446Abradant supplyingExaminersPrimary: Rose, Robert A.Assistant: Nguyen, George Attorney, Agent or FirmInternational ClassB24B 005/00AbstractAn apparatus for and method of conditioning a polishing pad suitable for in-situ use, is described. The apparatus consists of a wedge-shaped conditioning plate whose width varies as a function of its length and whose exact geometry is a function of the radial effects of the polishing process effecting conditioning of the polishing pad. The conditioning plate rests on the polishing pad and is surrounded by a loose-fitting frame that holds the conditioning plate stationary with respect to the rotating polishing table, preventing lateral movement of the conditioning plate, but allowing the plate to move in the vertical direction so that it can rest flat on the polishing pad. The bottom face of the conditioning plate has a roughened surface that serves to abrade the polishing pad and conditions it to an extent determined ostensibly by the downward force of the conditioning plate on the polishing pad, the roughness of the bottom surface of the conditioning plate, and the time the conditioning plate is in contact with the polishing pad surface.Other References
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