U.S. patents available from 1976 to present.
U.S. patent applications available from 2005 to present.

Apparatus and method for conditioning a chemical mechanical polishing pad

Patent 5775983 Issued on July 7, 1998. Estimated Expiration Date: Icon_subject July 7, 2015. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Patent References

Air-assisted buffing pad cleaning tool and associated cleaning methods
Patent #: 4959928
Issued on: 10/02/1990
Inventor: Hartwig, Sr.

Reconditioning tool for rotary faced buffing pad
Patent #: 5070570
Issued on: 12/10/1991
Inventor: Sabo

Method for conditioning the surface of a polishing pad
Patent #: 5081051
Issued on: 01/14/1992
Inventor: Mattingly, et al.

Pneumatic pad conditioner
Patent #: 5154021
Issued on: 10/13/1992
Inventor: Bombardier, et al.

Process for treating polishing cloths used for semiconductor wafers
Patent #: 5167667
Issued on: 12/01/1992
Inventor: Prigge, et al.

Polishing pad conditioning apparatus for wafer planarization process Patent #: 5216843
Issued on: 06/08/1993
Inventor: Breivogel, et al.

Inventors

Application

No. 431934 filed on 05/01/1995

US Classes:

451/444, Tool cleaner451/285, Rotary work holder451/287Planar surface abrading

Examiners

Primary: Smith, James G.
Assistant: Banks, Derris H.

Attorney, Agent or Firm

International Classes

B24B 021/18
B24B 033/00
B24B 047/26
B24B 055/00

Abstract

A method and apparatus for conditioning a polishing pad improves the polishing characteristics of the pad by providing an embedded pattern that facilitates polishing and reduces glazing. Moreover, the present invention conditions a pad without significantly abrading the polishing surface, thereby prolonging the pad's useful life. A series of independently rotatable rollers having a knurled outer surface is used to embed a pattern of score marks in the surface of the polishing pad. Alternatively, a knurled conical roller engages a radius of the pad. The apparatus is adaptable to either manual or automated processes. The present invention is particularly useful for conditioning polishing pads used in the fabrication of semiconductor wafers.

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