Cooling approach for high power integrated circuits mounted on printed circuit boards
Patent 5768104 Issued on June 16, 1998. Estimated Expiration Date: 
February 22, 2016. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
February 22, 2016. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesNoncontact thermal interface Apparatus for cooling high-density integrated circuit packages Board-mounted thermal path connector and cold plate Apparatus for solder nozzle height sensing Heat sink for semiconductor device assembly High performance integrated circuit chip package Patent #: 5325265 InventorsAssigneeApplicationNo. 605355 filed on 02/22/1996US Classes:361/704, Thermal conduction29/593, Including measuring or testing of device or component part257/714, Liquid coolant361/719Circuit board mountedExaminersPrimary: Tolin, Gerald P.Attorney, Agent or FirmForeign Patent References
International ClassH05K 007/20AbstractA method and apparatus for cooling high power integrated circuits mounted on a printed circuit board. The invention includes producing a cold plate adapted to receive the printed circuit board thereon. A series of thermal shims are produced in incremental varying thicknesses from a thermally conductive material. A gap between each integrated circuit and the cold plate is determined that would result when the plate and board are assembled. One of the thermal shims is selected for each gap, the thickness of each selected shim being dependent upon the gap for which it is selected. The shim is placed between the cold plate and the integrated circuit so that when the module is assembled, the gap is eliminated and a thermal conductive path between the cold plate and each circuit is created.Field of SearchElectrical device makingIncluding measuring or testing of device or component part Means to assemble electrical device Means to fasten electrical component to wiring board, base, or substrate Chip component Liquid With cold plate or heat sink Thermal conduction Through support means For active solid state devices For integrated circuit Circuit board mounted Plural With separable connector or socket means Stacked With provision for cooling the housing or its contents For integrated circuit Liquid coolant With heat sink With cooling means With electrical component cooling Liquid cooled HEAT TRANSMITTER Cooling electrical device Temperature compensator By measuring a counterbalancing or restoring force | |
