Method to reduce particulates in device manufacture
Patent 5766369 Issued on June 16, 1998. Estimated Expiration Date: 
October 4, 2016. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
October 4, 2016. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent References 3765941 Ultrasonic cleaning apparatus for an electrostatographic reproducing machine Method of manufacturing semiconductor wafer and system therefor Patent #: 5427644 InventorsAssigneeApplicationNo. 726181 filed on 10/04/1996US Classes:134/1.3, Semiconductor cleaning134/1, Including application of electrical radiant or wave energy to work134/6, Using solid work treating agents134/32, With work or work parts movable during treatment257/E21.224Chemical cleaning (EPO)ExaminersPrimary: Warden, JillAssistant: Markoff, Alexander Attorney, Agent or FirmInternational ClassB08B 007/02AbstractAn improved process for manufacturing semiconductor devices (10). The device, which could be a semiconductor wafer, an individual chip, or a device that has integrated within it semiconductor devices, such as a compact disk drive, is placed or held upside down with its working surface (12) open. The device (10) is struck, causing particulates (18) attached to the working surface (12) to fall free of the device. Alternately, the device could be sharply decelerated to apply the shock. Additionally, the device could be held substantially vertical and rotated to use centrifugal force to separate the particulates away from the device.Other References
Field of SearchIncluding application of electrical radiant or wave energy to workPlasma cleaning Semiconductor cleaning Semiconductor cleaning For metallic, siliceous, or calcareous basework, including chemical bleaching, oxidation or reduction Using solid work treating agents In particulate or comminuted form With work or work parts movable during treatment Oils, grease, tar, or wax removal, by dissolving | |
