Methods and apparatus for polishing a semiconductor wafer
Wafer polishing apparatus
Polishing apparatus of semiconductor wafer
Apparatus and method for polishing workpiece Patent #: 5670011
ApplicationNo. 807463 filed on 02/27/1997
US Classes:451/41, Glass or stone abrading451/5, Computer controlled451/285, Rotary work holder451/286, By means loosely confining work451/287, Planar surface abrading451/288, Having pressure plate451/289, Having vacuum or adhesive securing means451/388Vacuum
ExaminersPrimary: Rose, Robert A.
Assistant: Nguyen, George
Attorney, Agent or Firm
Foreign Patent References
International ClassB24B 005/00
AbstractA polishing apparatus for polishing a workpiece such as a semiconductor wafer has a turntable with a polishing surface, and a top ring for holding a workpiece and pressing the workpiece against the polishing surface under a first pressing. The polishing apparatus has a pressurized fluid source for supplying pressurized fluid, and a plurality of openings provided in the holding surface of the top ring for ejecting the pressurized fluid supplied from the pressurized fluid source. A plurality of areas each having the openings are defined on the holding surface so that the pressurized fluid is selectively ejectable from the openings in the respective areas.