Method of manufacturing chip-size package-type semiconductor device
Patent 5759873 Issued on June 2, 1998. Estimated Expiration Date: 
October 17, 2016. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
October 17, 2016. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesMethod and apparatus for taking electronic component out of carrier tape Method of mounting surface-mounted type electronic components on a printed circuit board Patent #: 4829663 InventorsAssigneeApplicationNo. 733207 filed on 10/17/1996US Classes:438/118, Including adhesive bonding step29/25.01, BARRIER LAYER OR SEMICONDUCTOR DEVICE MAKING257/E21.516, Involving automation techniques using film carriers (EPO)257/E23.179, Marks applied to semiconductor devices or parts, e.g., registration marks, test patterns, alignment structures, wafer maps (EPO)438/119, Electrically conductive adhesive438/125, Insulative housing or support438/401, Having substrate registration feature (e.g., alignment mark)438/462Having specified scribe region structure (e.g., alignment mark, plural grooves, etc.)ExaminersPrimary: Niebling, John F.Assistant: Zarneke, David A. Attorney, Agent or FirmInternational ClassesH01L 021/44H01L 021/48 H01L 021/50 Foreign Application Priority Data1995-10-19 JPAbstractIn a method of manufacturing a chip size semiconductor device comprising a semiconductor chip and a carrier tape including an insulating film and wiring patterns formed on one surface of the insulating film, the method comprises the steps of bonding the semiconductor chip and the carrier tape by the use of an adhesive film having a predetermined size corresponding to an adhesive area of the semiconductor chip. The step of bonding comprises the substeps of cutting away the adhesive film by punching from an adhesive film tape held above the semiconductor chip mounted on a table and subsequently setting the adhesive film on the adhesive area by moving the adhesive film downwardly.Field of SearchIncluding adhesive bonding stepElectrically conductive adhesive Insulative housing or support Having substrate registration feature (e.g., alignment mark) Having specified scribe region structure (e.g., alignment mark, plural grooves, etc.) Beam lead formation BARRIER LAYER OR SEMICONDUCTOR DEVICE MAKING Clicker die press | |
