Inspection apparatus of wiring board
February 23, 2016. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent References 3868508 Method for detecting and isolating faults in digital and analog circuits with multiple infrared scanning under conditions of different stimuli System for automatic inspection of periodic patterns Method of inspecting thin film transistor liquid crystal substrate and apparatus therefor Method of making a semiconductor device including infrared imaging, and apparatus for use in the imaging Active matrix substrate and a method for producing the same Patent #: 5576730 InventorApplicationNo. 606344 filed on 02/23/1996US Classes:382/149, Fault or defect detection324/770Liquid crystal device testExaminersPrimary: Boudreau, Leo H.Assistant: Werner, Frank E. Attorney, Agent or FirmForeign Patent References
International ClassesG01R 031/02G01J 005/10 Foreign Application Priority Data1995-02-27 JPAbstractAn object of the invention is to shorten the inspection time of wiring board. A high frequency signal is applied to source signal wiring of a substrate member 12 put on a table 13 from signal feeding means 17 through terminals of a frame 14. A signal of which voltage absolute value is greater than the voltage amplitude of the high frequency signal and voltage polarity is positive is applied to a scanning wiring of the substrate member 12. An infrared image of the substrate member 12 with signal applied is taken by image pickup means 15. In image processing means 16, from the image data fed from the image pickup means 15, an infrared image changing in contrast depending on the emission of infrared rays is formed, and the infrared image is divided into plural regions equal in the size of wiring pattern. In control means 18, the image of each divided region is compared with images of plural adjacent regions, and difference is detected. When a difference is detected, it is judged there is a defect in that region.Field of SearchLEAK OR FLAW DETECTIONInspection of semiconductor device or printed circuit board Inspecting printed circuit boards At plural magnifications or resolutions Fault or defect detection Faulty soldering IMAGE SEGMENTATION Of electronic circuit chip or board Electronic circuit chip or board (e.g., positioning) Infrared Including detector array With semiconductor sample Heating of object or material With defect discrimination circuitry Lead or wire bond inspection With camera With imaging Locating infrared emissive objects INFRARED AND ULTRAVIOLET With two images of single article compared Liquid crystal device test Using radiant energy Liquid crystal display segments Liquid crystal elements Thin film tansistor (TFT) Redundancy (e.g., plural control elements or electrodes) Liquid crystal display elements (LCD) DISPLAY WITH FAIL/SAFE TESTING FEATURE | |
