Curable resin composition
April 24, 2016. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesOil-resistant rubber composition Method for the preparation of organopolysiloxane Curable composition Adhesive silicone rubber compositions Hydrosilylative composition and process of hydrosilylation reaction Heat curable organopolysiloxane compositions Compositions for bonding organosiloxane elastomers to organic polymers Patent #: 5520767 InventorAssigneeApplicationNo. 638991 filed on 04/24/1996US Classes:525/100, With saturated Si-C or Si-H reactant or polymer thereof; or with solid copolymer derived from at least one Si-C or Si-H reactant wherein at least one of the reactants forming the solid copolymer is saturated; or with SPFI wherein at least one of the necessary ingredients contains a Si-C or Si-H bond or with a reaction product thereof; or with a SICP containing a Si-H or Si-C bond525/195, Contains a metal atom525/196, Agent contains a metal atom525/209, Solid polymer derived from reactant containing elements other than C, H, O, N, S, or Cl525/478Wherein one of said silicon materials contains Si-H bondExaminersPrimary: Cain, Edward J.Attorney, Agent or FirmForeign Patent References
International ClassC08F 001/00Foreign Application Priority Data1995-04-26 JPAbstractThe introduction of a novel curable resin composition that is characterized by the ability to cure at temperatures at or above its melting-initiation temperature through the rapid, hydrosilylation-based formation of a crosslinked structure. Said curable resin composition comprising(A) an acrylic resin that has at least 2 silicon-bonded alkenyl groups in each molecule and a melting-initiation temperature of at least 40° C.;(B) an acrylic resin that has at least 2 hydrosilyl groups in each molecule and a melting-initiation temperature of at least 40° C., in a quantity that yields a value from 1:0.3 to 1:30 for the molar ratio of silicon-bonded alkenyl groups in component (A) to silicon-bonded hydrogen atoms in component (B); and(C) a hydrosilylation reaction catalyst in sufficient quantity to cure the composition.Field of SearchContains a metal atomAgent contains a metal atom Solid polymer derived from reactant containing elements other than C, H, O, N, S, or Cl Wherein one of said silicon materials contains Si-H bond With saturated Si-C or Si-H reactant or polymer thereof; or with solid copolymer derived from at least one Si-C or Si-H reactant wherein at least one of the reactants forming the solid copolymer is saturated; or with SPFI wherein at least one of the necessary ingredients contains a Si-C or Si-H bond or with a reaction product thereof; or with a SICP containing a Si-H or Si-C bond | |
