Lead-free solder alloy
Patent 5733501 Issued on March 31, 1998. Estimated Expiration Date: 
July 5, 2016. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
July 5, 2016. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesLead-free, high temperature, tin based multi-component solder Lead-free solder alloys Soldering composition Composite solders Patent #: 5520752 InventorsAssigneeApplicationNo. 675825 filed on 07/05/1996US Classes:420/562, Antimony, or bismuth containing420/557TIN BASEExaminersPrimary: Ip, SikyinAttorney, Agent or FirmForeign Patent References
International ClassesB23K 035/26C22C 013/00 Foreign Application Priority Data1995-07-04 JPAbstractA lead-free solder alloy comprises 0.8 to 5.0% inclusive by weight of Ag, not less than 0.1% by weight of In, not less than 0.1% by weight of Bi, the total amount of In and Bi being not more than 17% by weight and the balance of Sn and inevitable impurities. The other lead-free solder alloy further contains 0.1 to 10% by weight of Sb. These solder alloys have low melting point and narrow melting range, and furthermore, they show excellent wettability and mechanical characteristics. | |
