Lead-free, tin-based multi-component solder alloys
March 6, 2016. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesSolder system Tin base lead-free solder composition containing bismuth, silver and antimony Low temperature-wetting tin-base solder paste Lead-free alloy containing tin, silver and indium Lead-free, high temperature, tin based multi-component solder Lead-free, high tin, ternary solder alloy of tin, bismuth, and indium Article comprising a PB-free solder having improved mechanical properties Patent #: 5538686 InventorsApplicationNo. 612614 filed on 03/06/1996US Classes:420/562, Antimony, or bismuth containing29/840, By metal fusion228/180.1, Simultaneous bonding of multiple joints (e.g., dip soldering of printed circuit boards)228/180.21Component terminal to substrate surface (i.e., nonpenetrating terminal)ExaminersPrimary: Ip, SikyinAttorney, Agent or FirmForeign Patent References
International ClassC22C 005/04AbstractThe present invention provides a solder alloy having from about 80-81% tin, from about 2-4% silver, from about 5-6% indium, and from about 10-12% bismuth by weight, and microelectric circuits soldered by this alloy. | |
