Patent ReferencesScanning tunneling microscope Method and apparatus for dry processing of substrates Method of making an integrated scanning tunneling microscope Memory device with dual cantilever means Integrated micromechanical piezoelectric motor Process for producing multilayer interconnection for semiconductor device with interlayer mechanical stress prevention and insulating layers Method of dry etching in semiconductor device processing Microvibratory memory device Methods of fabricating integrated, aligned tunneling tip pairs Integrated circuit micro-fabrication using dry lithographic processes InventorsAssigneeApplicationNo. 507676 filed on 07/25/1995US Classes:365/174, Semiconductive369/126, Electrical modification or sensing of storage medium (e.g., capacitive, resistive, electrostatic charge)369/127Mechanical modification or sensing of storage mediumExaminersPrimary: Nguyen, Viet Q.Attorney, Agent or FirmForeign Patent References
International ClassH01L 021/44AbstractA microelectromechanical device is comprised of a cantilevered beam positioned above, and free to move relative to, a substrate. The beam may carry a plurality of conductors which are insulated from one another. One or more tips is positioned on the beam with each tip being in electrical contact with one of the conductors. A memory device may be constructed by providing an array of such cantilevered beams proximate to a layer of media. Devices for positioning the beam in x and y directions perpendicular to each other and parallel to the layer of media and in a z direction perpendicular to the media are provided. A control circuit generates control signals input to the positioning devices for positioning the tips according to x, y, and z coordinates. A read/write circuit which is in electrical communication with the conductors of the beam, provide signals to the tips to cause the tips to write those signals to the layer of media in a write mode and to read previously written signals sensed by the tips in a read mode. A fabrication method is also disclosed.Other References
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