U.S. patents available from 1976 to present.
U.S. patent applications available from 2005 to present.

Isogrammetric analysis method for high-yield processes

Patent 5715181 Issued on February 3, 1998. Estimated Expiration Date: Icon_subject April 3, 2015. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Patent References

Performance control apparatus and method in a processing plant
Patent #: 5134574
Issued on: 07/28/1992
Inventor: Beaverstock, et al.

Integrated quality control method and system
Patent #: 5245554
Issued on: 09/14/1993
Inventor: Tsuyama, et al.

Statistical process control for air separation process
Patent #: 5257206
Issued on: 10/26/1993
Inventor: Hanson

Method and system for real-time statistical process monitoring
Patent #: 5311759
Issued on: 05/17/1994
Inventor: Mangrulkar, et al.

Real-time statistical process monitoring system
Patent #: 5339257
Issued on: 08/16/1994
Inventor: Layden, et al.

Process control method for improving manufacturing operations Patent #: 5440478
Issued on: 08/08/1995
Inventor: Fisher, et al.

Inventor

Application

No. 415651 filed on 04/03/1995

US Classes:

702/180, Histogram distribution257/E21.525, Procedures, i.e., sequence of activities consisting of plurality of measurement and correction, marking or sorting steps (EPO)700/109, Quality control700/110, Defect analysis or recognition702/81, Quality evaluation702/182Performance or efficiency evaluation

Examiners

Primary: Voeltz, Emanuel T.
Assistant: Cole, Tony M.

International Class

G06F 019/00

Abstract

A method is provided for process monitoring by statistical measurement of level-of-defectives performance in manufacturing and other processes. Statistical performance data functions of mean-value shift and deviation ratio are plotted on an isogrammetric chart for off-line analysis or, alternatively, are entered into a computer that has been programmed with the isogrammetric format. The resultant information revels the probable process yield and is useful to certify quality of performance in direct terms of level of defectives being produced. The method is particularly useful for high-yield processes where statistical sampling and inspection methods tend to miss the relatively few defectives and statistical process control (SPC) criteria appear to indicate that a manufacturing process is "in control".

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