U.S. patents available from 1976 to present.
U.S. patent applications available from 2005 to present.

Method and equipment for growing thin films

Patent 5711811 Issued on January 27, 1998. Estimated Expiration Date: Icon_subject October 2, 2016. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Patent References

3730696

Method for producing compound thin films
Patent #: 4058430
Issued on: 11/15/1977
Inventor: Suntola ,   et al.

Apparatus for chemical vapor deposition
Patent #: 4062318
Issued on: 12/13/1977
Inventor: Ban ,   et al.

Radiation heated reactor for chemical vapor deposition on substrates
Patent #: 4263872
Issued on: 04/28/1981
Inventor: Ban

RF Heating coil construction for stack of susceptors
Patent #: 4339645
Issued on: 07/13/1982
Inventor: Miller

Apparatus for performing growth of compound thin films
Patent #: 4389973
Issued on: 06/28/1983
Inventor: Suntola ,   et al.

Method for performing growth of compound thin films
Patent #: 4413022
Issued on: 11/01/1983
Inventor: Suntola ,   et al.

Chemical vapor deposition reactor for silicon epitaxial processes
Patent #: 4421786
Issued on: 12/20/1983
Inventor: Mahajan ,   et al.

Film forming apparatus
Patent #: 4825806
Issued on: 05/02/1989
Inventor: Tawada ,   et al.

Apparatus for atomic layer epitaxial growth
Patent #: 4993357
Issued on: 02/19/1991
Inventor: Scholz

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Inventors

Assignee

Application

No. 682703 filed on 10/02/1996

US Classes:

118/719, Multizone chamber118/715, GAS OR VAPOR DEPOSITION118/725Substrate heater

Examiners

Primary: Breneman, R. Bruce
Assistant: Lund, Jeffrie R.

Attorney, Agent or Firm

Foreign Patent References

  • 0015390 A1 EP. 09/24/1980
  • 0 015 390 A1 EP. 09/24/1980
  • 0559326 A1 EP. 09/24/1993
  • 31 48 620 C2 DE. 05/24/1986
  • 37 39 528 A1 DE. 06/24/1989
  • 39 36 016 A1 DE. 05/24/1991
  • 59-111997 JP. 06/24/1984
  • 61-26217 JP 02/24/1986
  • 61-289623 JP 12/24/1986
  • 63-112495 JP. 05/24/1988

International Class

C23C 016/00

Foreign Application Priority Data

1994-11-28 FI

Abstract

The invention relates to equipment for growing a thin film onto a substrate. The equipment suited to implement the invention comprises a reaction space having a reaction chamber therein into which a substrate is placed and is subjected to alternately repeated surface reactions of at least two vapor-phase reactants for the purpose of forming a thin film. The equipment further comprises recesses/openings communicating with the reaction space to form gas inflow and outflow channels. The reactants are fed in the form of vapor-phase pulses repeatedly and alternately into the reaction space through the inflow channels, each reactant separately from its own source. The vapor-phase reactants are brought to react with the surface of the substrate for the purpose of forming a solid-state thin film compound on said substrate. The gaseous reaction products and possible excess reactants are removed in gas phase from the reaction space via the outflow channels.

Other References

  • R.R. Garnache and D. M. Kenney, Deposit and Clean Deposition System, IBM Technical Disclosure Bulletin, p. 2083, Dec. 1970
  • Suntola, Tuomo, "Atomic layer epitaxy," Thin Solid Films, vol. 216, pp. 84-89, 199
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