Apparatus and method for distribution of slurry in a chemical mechanical polishing system
October 27, 2015. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent References 3028711 3261510 3848366 Method for polishing titanium carbide Abrasive slurry supply system for use in metallographic sample preparation Method for polishing detector material Apparatus for guiding the flow of abrasive slurry over a lapping surface Wafer flood polishing Method for planarizing semiconductor wafers with a non-circular polishing pad Slurry polisher using ultrasonic agitation InventorsApplicationNo. 549481 filed on 10/27/1995US Classes:451/287, Planar surface abrading451/285, Rotary work holder451/286, By means loosely confining work451/446, Abradant supplying451/447GraderExaminersPrimary: Rose, Robert A.Assistant: Nguyen, George Attorney, Agent or FirmInternational ClassB24B 005/00AbstractSlurry is provided to the surface of the polishing pad by pumping the slurry up through a central port, or by dripping the slurry down onto the surface of the polishing pad from a slurry feed tube. A slurry wiper, which may have one or more flexible members, sweeps the slurry evenly and thinly across the polishing pad. A control system coordinates the distribution of slurry to the polishing pad with the motion of the carrier head. | |
