Method of forming bond pad structure for the via plug process
Patent 5700735 Issued on December 23, 1997. Estimated Expiration Date: 
August 22, 2016. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
August 22, 2016. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesMethod for making a planar multi-layer metal bonding pad Structure and method for corrosion and stress-resistant interconnecting metallurgy Semiconductor bond pad structure and method Patent #: 5403777 InventorsApplicationNo. 703918 filed on 08/22/1996US Classes:438/612, Forming solder contact or bonding pad257/E23.02, Bonding areas, e.g., pads (EPO)438/622, Multiple metal levels, separated by insulating layer (i.e., multiple level metallization)438/637, With formation of opening (i.e., viahole) in insulative layer438/672Plug formation (i.e., in viahole)ExaminersPrimary: Quach, T. N.Attorney, Agent or FirmInternational ClassH01L 021/60AbstractA bond pad structure and method of forming the bond pad structure which provides for reliable interconnections between the bond pad structure and the next level of circuit integration. The bond pad structure uses three metal pads separated by layers of dielectric. Via plugs are formed between the first and second metal pads and between the second and third metal pads. The via plugs are formed in a diamond shape with respect to the metal pads. The metal pads are squares with the same orientation. The periphery of the via plugs forms a square rotated 45° with respect to the square metal pads.Other References
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