Polishing slurries comprising two abrasive components and methods for their use
October 10, 2015. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesAluminum oxide/aluminum oxynitride/group IVB metal nitride abrasive particles derived from a sol-gel process Chem-mech polishing method for producing coplanar metal/insulator films on a substrate Polishing composition Via-filling and planarization technique Method and composition for polishing metal surfaces Method of chemical mechanical polishing aluminum containing metal layers and slurry for chemical mechanical polishing Two-step chemical mechanical polishing process for producing flush and protruding tungsten plugs Slurries for chemical mechanical polishing Polishing composition Activated polishing compositions InventorsApplicationNo. 541898 filed on 10/10/1995US Classes:216/88, Using film of etchant between a stationary surface and a moving surface (e.g., chemical lapping, etc.)51/309, Metal or metal oxide216/89, Etchant contains solid particle (e.g., abrasive for polishing, etc.)216/100, Substrate contains elemental metal, alloy thereof, or metal compound216/102, Metal is elemental aluminum, an alloy, or compound thereof216/105, Metal is elemental copper, an alloy, or compound thereof252/79.1ETCHING OR BRIGHTENING COMPOSITIONSExaminersPrimary: Breneman, R. BruceAssistant: Alanko, Anita Attorney, Agent or FirmForeign Patent References
International ClassesC23F 001/00C23F 001/44 AbstractAn aqueous slurry is provided for polishing or planarizing a work piece which contains a metal, the solids portion of said slurry being comprised of 1 to 50 percent by weight of submicron alpha-alumina, the remainder of the solids being of a substantially less abrasive composition chosen from the group consisting of aluminum hydroxides, gamma-alumina, delta-alumina, amorphous alumina, and amorphous silica. Also provided is a method for polishing the surface of a work piece which contains a metal wherein said aqueous slurry is used as the polishing composition during chemical-mechanical polishing.Other References
Field of SearchUsing film of etchant between a stationary surface and a moving surface (e.g., chemical lapping, etc.)Etchant contains solid particle (e.g., abrasive for polishing, etc.) Substrate contains elemental metal, alloy thereof, or metal compound Metal is elemental aluminum, an alloy, or compound thereof Metal is elemental copper, an alloy, or compound thereof ETCHING OR BRIGHTENING COMPOSITIONS Polishes Natural resin or derivative containing Metal or metal oxide | |
