Apparatus and method for polishing workpiece
Patent 5674109 Issued on October 7, 1997. Estimated Expiration Date: 
September 13, 2015. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
September 13, 2015. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.InventorsAssigneeApplicationNo. 527421 filed on 09/13/1995US Classes:451/41, Glass or stone abrading451/285, Rotary work holder451/286, By means loosely confining work451/287, Planar surface abrading451/288, Having pressure plate451/289, Having vacuum or adhesive securing means451/290Disk or wheel abraderExaminersPrimary: Rose, Robert A.Assistant: Nguyen, George Attorney, Agent or FirmInternational ClassB24B 001/00AbstractA polishing apparatus has a circular abrasive cloth on a turntable, and a top ring for holding a workpiece and pressing the workpiece against the circular abrasive cloth to polish the workpiece while the circular abrasive cloth is rotated about a center axis and the workpiece is rotated by the top ring about a top ring axis located at a positioned spaced from the center axis. The position is spaced from the center axis by a distance rc, and the workpiece has a radius rw. When the workpiece is not angularly moved with respect to the circular abrasive cloth wile the workpiece is being polished, a ratio Rc=rc/rw is in a range from 1.10 to 2.60. When the workpiece is angularly moved at a radius rs through an angular displacement ø (degrees) in arcuate reciprocating motions with respect to the circular abrasive cloth, a ratio Rs=rs/rw, the angular displacement ø, and the ratio Rc are selected to be of a certain relationship.Other References
| |
