U.S. patents available from 1976 to present.
U.S. patent applications available from 2005 to present.

Apparatus for electrostatically depositing and retaining materials upon a substrate

Patent 5669973 Issued on September 23, 1997. Estimated Expiration Date: Icon_subject June 6, 2015. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Patent References

Re30401

2408143

3831606

Medicament dispensing process for inhalation therapy
Patent #: 3971377
Issued on: 07/27/1976
Inventor: Damani

Inhalator for agglomeratable pulverulent solids
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Three electrode system in the generation of electrostatic images
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Issued on: 07/03/1979
Inventor: Carrish

Novel dosage forms
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Inventor: Sheridon

Medicament inhalation device
Patent #: 4570630
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More ...

Inventor

Assignee

Application

No. 467647 filed on 06/06/1995

US Classes:

118/624, Control of deposition of coating material or selective area, e.g., pattern or edge effect118/625, Plural electrodes selectively energized118/696, PROGRAM, CYCLIC, OR TIME CONTROL118/698, Having selection means for alternate operational sequences128/203.15, Particulate treating agent carried by breathed gas128/203.23, Pocket-type draw tube having discharge aperture for air/treating agent mixture at end thereof604/58Powder dispenser

Examiners

Primary: Warden, Jill
Assistant: Ludlow, Jan

Attorney, Agent or Firm

Foreign Patent References

  • WO 93/0983 WO. 05/23/1993
  • WO 94/08552 WO. 04/23/1994
  • WO 94/13271 WO. 06/23/1994
  • WO 94/23772 WO. 10/23/1994
  • WO 95/00127 WO. 01/23/1995

International Class

B05B 005/10

Abstract

Apparatus having a substrate having a planar conductive plating located on a first surface of a dielectric layer and having a conductive trace (a collection trace) located on a second surface of the dielectric layer such that the conducting plating and the conductive trace have a parallel, spaced-apart relation. The conductive trace is charged by supplying a voltage to the plating and the trace to establish a voltage differential across the dielectric layer. As such, depending upon the magnitude of the voltage, polarity of the voltage and the duration for which the voltage is applied to the trace, a certain quantity and polarity of charge accumulates on the trace. The material to be deposited is charged to an opposite polarity than that of the trace and then the deposition material is applied to the trace. Consequently, the substrate electrostatically retains the deposition material on the collection trace.

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