IC component mounting method and apparatus
May 1, 2015. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesRobotic system for mounting electrical components Method of loading surface mounted device and an apparatus therefor Machine for bonding leads to non-coplanar substrates Method of packaging electronic component parts using a eutectic die bonder Apparatus for mounting components Bonding tool, production and handling thereof System for placement and mounting of fine pitch integrated circuit devices Patent #: 5471310 InventorsApplicationNo. 432579 filed on 05/01/1995US Classes:228/102, With condition responsive, program, or timing control228/6.2, With electrical connection made at joint228/9, Work-responsive (e.g., temperature, orientation of work, etc.)228/105, Using optical viewing means (e.g., microscope)228/180.22, Lead-less (or "bumped") device348/87Electronic circuit chip or board (e.g., positioning)ExaminersPrimary: Ramsey, Kenneth J.Attorney, Agent or FirmInternational ClassH01L 021/58Foreign Application Priority Data1994-05-06 JPAbstractAn IC component mounting method includes sucking each of different types of IC components at a supply position to which the IC component having an electrode-provided face thereof to be bonded to a circuit board, recognizing an image of the IC component to detect a sucking position at which a sucking nozzle does not interfere with an electrode of the IC component, detecting a height of the sucking position, positioning the sucking nozzle at the sucking position while the position of the sucking nozzle in a vertical direction is controlled, sucking the IC component by a mounting head, recognizing a position of the IC component sucked by the mounting head, and recognizing a reference position of the circuit board or an IC component-mounting position thereof, and positioning the IC component at the IC component-mounting position of the circuit board and then mounting the IC component on the circuit board.Field of SearchWith electrical connection made at jointWork-responsive (e.g., temperature, orientation of work, etc.) Work portion comprises electrical component With condition responsive, program, or timing control Using optical viewing means (e.g., microscope) Component terminal to substrate surface (i.e., nonpenetrating terminal) Lead-less (or "bumped") device Electronic circuit chip or board (e.g., positioning) Alignment or positioning | |
