Method and apparatus for polishing a semiconductor substrate wafer
Patent 5665656 Issued on September 9, 1997. Estimated Expiration Date: 
May 17, 2015. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
May 17, 2015. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent References 2618911 2730851 3461617 3872626 19-Hydroxy-19-methyl-6,9-epoxymethano-PGF compounds Polishing machine Method of holding and polishing a workpiece Upper plate driving system for surface lapping machine Planetary lap Surface grinding machine InventorApplicationNo. 443133 filed on 05/17/1995US Classes:438/692, Simultaneous (e.g., chemical-mechanical polishing, etc.)438/693, Utilizing particulate abradant451/41, Glass or stone abrading451/283, Work rotating451/285, Rotary work holder451/287, Planar surface abrading451/288Having pressure plateExaminersPrimary: Bowers, Charles L. Jr.Assistant: Whipple, Matthew Attorney, Agent or FirmForeign Patent References
International ClassH01L 021/304AbstractA semiconductor wafer polishing apparatus includes a housing and a turntable mounted in the housing. The turntable has an axis of rotation and a surface for affixing a semiconductor wafer. The polishing apparatus also includes a motor mounted to the housing and connected to the turntable to supply a torque for rotating the turntable about the axis of rotation. A polishing assembly is connected to the housing and extends adjacent to the turntable surface. A polishing pad is affixed to the polishing assembly and is positionable to contact the semiconductor wafer. Some polishing pads are cylindrical in form. Other polishing pads have a conical form. | |
