U.S. patents available from 1976 to present.
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Method and apparatus for measuring substrate temperatures

Patent 5660472 Issued on August 26, 1997. Estimated Expiration Date: Icon_subject December 19, 2014. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Patent References

3796099

Method and apparatus for measuring emissivity
Patent #: 4408878
Issued on: 10/11/1983
Inventor: Fischbach

Pyrometer measurements in the presence of intense ambient radiation
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Issued on: 09/16/1986
Inventor: Stein

Emissivity error correcting method for radiation thermometer
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Issued on: 04/21/1987
Inventor: Brouwer ,   et al.

Reflection corrected radiosity optical pyrometer
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Inventor: Suarez-Gonzalez

Radiation thermometry
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Inventor: Tanaka, et al.

Emissivity correction apparatus and method
Patent #: 4919542
Issued on: 04/24/1990
Inventor: Nulman, et al.

Method and apparatus for real-time wafer temperature measurement using infrared pyrometry in advanced lamp-heated rapid thermal processors
Patent #: 4956538
Issued on: 09/11/1990
Inventor: Moslehi

Method for measuring surface temperature of semiconductor wafer substrate, and heat-treating apparatus
Patent #: 4979134
Issued on: 12/18/1990
Inventor: Arima, et al.

Method and apparatus to simultaneously measure emissivities and thermodynamic temperatures of remote objects
Patent #: 5011295
Issued on: 04/30/1991
Inventor: Krishnan, et al.

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Inventors

Application

No. 359302 filed on 12/19/1994

US Classes:

374/128, Having significant signal handling circuitry (e.g., linearizing, emissivity compensation)374/126Having emissivity compensating or specified radiating surface

Examiners

Primary: Cuchlinski, William A. Jr.
Assistant: Hirshfeld, Andrew H.

Attorney, Agent or Firm

Foreign Patent References

  • A 0 612 862 EP. 08/13/1994

International Class

G01J 005/06

Abstract

A method of correcting a temperature probe reading in a thermal processing chamber for heating a substrate, including the steps of heating the substrate to a process temperature; using a first probe and a second probe to measure the temperature of the substrate, the first probe having a first effective reflectivity and the second chamber having a second effective reflectivity, the first probe producing a first temperature indication and the second probe producing a second temperature indication, and wherein the first and second effective reflectivities are different; and from the first and second temperature indications, deriving a corrected temperature reading for the first probe, wherein the corrected temperature reading is a more accurate indicator of an actual temperature of the substrate than are uncorrected readings produced by both the first and second probes.

Other References

  • Deardorff, "Elimination of reflection errors in emissometers by using alternate apertures," Rev. Sci. Instrum., vol. 47 No. 10:1279-1282 (Oct. 1976)
  • Doering, "Microelectronics Manufacturing Science and Technology Program Extends Capabilities in Integrated--Circuit Manufacturing", Microelectronics Manufacturing Science & Technology, 2-64 (1994)
  • Apte et al., "Rapid Thermal Processing Uniformity Using Multivariable Control of a Circularly Symmetric 3 Zone Lamp", IEEE Transactions on Semiconductor Manufacturing, 5, 180-188 (1992)
  • Roozeboom, "Manufacturing Equipment Issues in Rapid Thermal Processing", Rapid Thermal Processing Science and Technology 349-423 (1993)
  • Pikashov et al., "Determining Emissivity And True Surface Temperature By Means Of A Pyrometer And An Attachment", Gas Institute, Kiev., translated from Inzhenerno-Fizicheskii Zhurnal, 16, 723-730 (1969)
  • Roozeboom, "Rapid Thermal Processing; Status, Problems and Options After the First 25 Years", Mat.Res. Soc. Symp.Proc. 303, 149-164 (1993)
  • Gyurcsik, et al., "A Model For Rapid Thermal Processing: Achieving Uniformity Through Lamp Control", IEEE Transactions on Semiconductor Manufacturing, 4, 9-13 (1991)
  • Sorrell et al., "Temperature Uniformity in RTP Furances", IEEE Transactions on Electron Devices 39, 75-80 (1992)
  • A. Honda et al., "New Radiation Thermometry Using Multiple Reflection For Temperature Measurement of Steel Sheets", American Institute of Physics 923-927
  • A. Gouffe, Revue D'optique 24, 1-10 (1945) with translation
  • Dilhac et al., "Temperature Control in a Rapid Thermal Processor", IEEE Transactions on Electron Devices, 39 201-203 (1992)
  • Norman, "Optimization of Transient Temperature Uniformity in RIP Systems", IEEE Transactions On Electron Devices 39, 205-207 (1992
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