Lead-free solder
Patent 5658528 Issued on August 19, 1997. Estimated Expiration Date: 
September 13, 2016. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
September 13, 2016. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesLead-free alloy containing tin, silver and indium Lead-free, high temperature, tin based multi-component solder High temperature, lead-free, tin based solder composition Patent #: 5393489 InventorsAssigneeApplicationNo. 712678 filed on 09/13/1996US Classes:420/562, Antimony, or bismuth containing148/22, COMPOSITIONS420/557TIN BASEExaminersPrimary: Ip, SikyinAttorney, Agent or FirmForeign Patent References
International ClassC22C 013/02Foreign Application Priority Data1994-11-02 JPAbstractA lead-free solder consisting of 1 to 4 wt % of Ag, at least one of Bi and In in respective amounts meeting the conditions that the value of expression (1), A, is equal to or greater than 5.00 and that the value of expression (2), B, is equal to or less than 6.90, and Sn for the balance:A=[Ag wt %]+1.23 [Bi wt %]+0.52 [In wt %] (1)B=[Ag wt %]+1.19 [Bi wt %]+0.50 [In wt %] (2)This solder has a tensile strength and an elongation as high as those of conventional Pb--Sn solder without containing neither lead nor cadmium, which can cause environmental contamination.Other References
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