Semiconductor wafer cleaning system
December 21, 2014. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent References 2961354 3690333 3893869 Combined ultrasonic cleaning and biocidal treatment in a single pressure vessel Automatic ultrasonic cleaning apparatus Vessel and system for treating wafers with fluids Apparatus for treating semiconductor wafers Apparatus for cleaning, rinsing and drying substrates Vessel and system for treating wafers with fluids Method of treating wafers with fluid InventorsAssigneeApplicationNo. 361139 filed on 12/21/1994US Classes:134/1, Including application of electrical radiant or wave energy to work134/2, For metallic, siliceous, or calcareous basework, including chemical bleaching, oxidation or reduction134/3, Including acidic agent134/26, Using sequentially applied treating agents134/28, One an acid or an acid salt134/34, With treating fluid motion134/41, Metal base work, acid treating257/E21.228Wet cleaning only (EPO)ExaminersPrimary: El-Arini, ZeinabAttorney, Agent or FirmInternational ClassesB08B 003/08B08B 003/12 B08B 007/02 C23G 001/02 AbstractSemiconductor wafers are positioned in a cleaning tank and subjected to sequential flows of one or more highly diluted cleaning solutions that are injected from the lower end of the tank and allowed to overflow at the upper end. One solution contains one part ammonium hydroxide, two parts hydrogen peroxide, and 300-600 parts deionized water together with a trace of high purity surfactant. Rinsing water is flowed through the tank after the first solution is dumped. A second solutions contains highly dilute hydrofluoric acid. A third solution is more dilute than the first solution. A fourth solution contains hydrochloric acid greatly diluted with deionized water. The cleaning tank is provided with a megasonic generator in its lower portion for selective application of megasonic energy. Quick dump valves in the tank bottom enable the solutions to be quickly dumped followed by one or more rinse steps, including a quick refill while spraying and then dumping of the rinsing water.Other References
Field of SearchIncluding application of electrical radiant or wave energy to workFor metallic, siliceous, or calcareous basework, including chemical bleaching, oxidation or reduction Including acidic agent Using sequentially applied treating agents One an acid or an acid salt With treating fluid motion Metal base work, acid treating | |
