Conductive paste compound for via hole filling, printed circuit board which uses the conductive paste
October 28, 2014. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesCopper filled conductive epoxy Method of making a through-hole connector Photosensitive conductive metal composition Conductive elastomeric ink composition Process for preparing conductive fine particles Circuit board construction Copper alloy compositions Assembly using electrically conductive cement Porous substrate and conductive ink filled vias for printed circuits Patent #: 5346750 InventorsAssigneeApplicationNo. 330733 filed on 10/28/1994US Classes:428/209, Including metal layer252/511, Resin, rubber, or derivative thereof containing252/514, Noble metal (gold, silver, ruthenium, rhodium, palladium, osmium, iridium, platinum)361/749, Flexible board428/323, Including a second component containing structurally defined particles428/901PRINTED CIRCUITExaminersPrimary: Ryan, PatrickAssistant: Jewik, Patrick Attorney, Agent or FirmForeign Patent References
International ClassB32B 009/00Foreign Application Priority Data1993-10-29 JPAbstractA conductive paste compound for via hole filling includes a conductive filler at 80 to 92 weight percent with an average particle size of from 0.5 to 20 μm and specific surface of from 0.1 to 1.5 m2 /g, a liquid epoxy resin at 4.5 to 20 weight percent containing 2 or more epoxy groups with room temperature viscosity of 15 Pa⋅sec or less, and a hardener at 0.5 to 5 weight percent, wherein the viscosity is 2,000 Pa⋅sec or less and the volatile amount is 2.0 weight percent or less. A filling paste and a printed circuit board with use thereof are provided which can conduct an inner-via-hole connection between electrode layers without using a through-hole plating technique.The conductive paste comprises a metallic particle such as copper, an epoxy resin, a hardener, and if necessary, a dispersant. The paste having low viscosity and low volatility under high shear is used to fill holes disposed in a laminated substrate. Then, this substrate is heated and pressurized together with copper foil on both sides to attain a printed circuit board where both sides are electrically inner-via-hole connected.Other References
Field of SearchIncluding a second component containing structurally defined particlesIncluding metal layer PRINTED CIRCUIT Next to metal or compound thereof Ink in pores Including ceramic, glass, porcelain or quartz layer Processes of preparing or treating a solid polymer by wave energy in the presence of a designated nonreactant material (DNRM); or compositions therefore Flexible board Resin, rubber, or derivative thereof containing Noble metal (gold, silver, ruthenium, rhodium, palladium, osmium, iridium, platinum) | |
