Apparatus and method for polishing workpiece
Patent 5651725 Issued on July 29, 1997. Estimated Expiration Date: 
April 10, 2016. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
April 10, 2016. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesPolishing apparatus O-ring seal for rock bit bearings Device for conditioning polishing pads Semiconductor substrate conditioning head having a plurality of geometries formed in a surface thereof for pad conditioning during chemical-mechanical polish Patent #: 5536202 InventorsAssigneeApplicationNo. 628990 filed on 04/10/1996US Classes:451/41, Glass or stone abrading451/57, Combined abrading451/285, Rotary work holder451/286, By means loosely confining work451/287, Planar surface abrading451/288, Having pressure plate451/444Tool cleanerExaminersPrimary: Rose, Robert A.Assistant: Nguyen, George Attorney, Agent or FirmInternational ClassesB24B 001/00B24B 007/19 B24B 007/30 Foreign Application Priority Data1995-04-10 JPAbstractAn apparatus and method for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The workpiece is held by a top ring, and a surface of the workpiece is polished by pressing the workpiece against an abrasive cloth mounted on a turntable while applying an abrasive solution onto the abrasive cloth. While the workpiece is being polished, a surface of the abrasive cloth is dressed while applying a dressing liquid onto the abrasive cloth. A polishing operation and a dressing operation are performed in such a state that the abrasive solution and the dressing liquid do not interfere with each other. | |
