Large integrated circuit with modular probe structures
November 30, 2014. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesSemiconductor integrated circuit device CMOS powerless rom code mask option select Modularized scan path for serially tested logic circuit Partitioned scan-testing system Dynamic semiconductor memory device having a simultaneous test function for divided memory cell blocks Packaged semiconductor device with test circuits for determining fabrication parameters Standard cell having test pad for probing and semiconductor integrated circuit device containing the standard cells Built-in-test by signature inspection (bitsi) Spatial light modulator and method Standard independent digitized video system InventorsAssigneeApplicationNo. 347021 filed on 11/30/1994US Classes:324/763, DUT including test circuit324/765, Test of semiconductor device714/733Built-in testing circuit (BILBO)ExaminersPrimary: Karlsen, Ernest F.Attorney, Agent or FirmInternational ClassG01R 031/28AbstractA large integrated circuit (10) of modular design, each module (12,14,16) having a circuit section (22,24,34) and a separate dedicated testing pad section (20). Each circuit module (12,14,16) can be individually functionally tested as an independent circuit with conventional prober equipment for defects. Each testing pad section (20) facilitates controlling the entire integrated circuit (10) so that the respective module circuit section (12,14,16) can be tested. Control circuitry (26) comprised of pass gates is provided to isolate the testing pad sections (20) from the operational portion (22,24,34) of the integrated circuit (10) when not under test. The present invention is ideally suited for large spatial light modulators, memory devices and other large sophisticated integrated circuits. | |
