Apparatus and method for conditioning a planarizing substrate used in chemical-mechanical planarization of semiconductor wafers
Patent 5645682 Issued on July 8, 1997. Estimated Expiration Date: 
May 28, 2016. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
May 28, 2016. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesPolishing apparatus Patent #: 5384986 InventorApplicationNo. 654134 filed on 05/28/1996US Classes:438/692, Simultaneous (e.g., chemical-mechanical polishing, etc.)451/56, With tool treating or forming451/60Abradant supplyingExaminersPrimary: Breneman, R. BruceAssistant: Stein, Julie E Attorney, Agent or FirmInternational ClassB24B 053/007AbstractAn apparatus for chemically conditioning a surface of a planarizing substrate while a semiconductor wafer is planarized on the substrate. The conditioning apparatus has a conditioning solution dispenser that deposits a conditioning solution onto the substrate, and a conditioning solution barrier that removes the conditioning solution from the substrate to prevent the conditioning solution from contacting the wafer or diluting the planarizing solution. The conditioning solution dispenser is positioned over the planarizing substrate down-stream from the wafer with respect to the path along which the substrate travels. The conditioning solution barrier is positioned down-stream from the conditioning solution dispenser and upstream from the wafer to remove the conditioning solution from the surface of the substrate. The conditioning solution barrier accordingly cleans the surface of the substrate so that planarizing solution may be dispensed onto a surface relatively free from other fluids or particles.Field of SearchUsing film of etchant between a stationary surface and a moving surface (e.g., chemical lapping, etc.)Relative movement between the substrate and a confined pool of etchant Rotating, repeated dipping, or advancing movement of substrate Projecting etchant against a moving substrate or controlling the angle or pattern projection of the etchant or controlling the angle or pattern of movement of the substrate Tool cleaner Abradant supplying Grader With tool treating or forming Abradant supplying | |
