Workpiece deburring method and apparatus
Planetary-type lapping device for finish-grinding the valve seat of a safety relief valve
Device for conditioning polishing pads Patent #: 5486131
ApplicationNo. 571598 filed on 12/13/1995
US Classes:451/444, Tool cleaner451/56, With tool treating or forming451/211, Planetary451/270, Orbital451/271, Planetary451/287Planar surface abrading
ExaminersPrimary: Rose, Robert A.
Assistant: Nguyen, George
Attorney, Agent or Firm
Foreign Patent References
International ClassesB24B 021/18
Foreign Application Priority Data1994-12-16 JP
AbstractA dressing apparatus is used to resurface a polishing surface of a polish cloth used to polish semiconductor wafers. A dressing brush which spins on its own axis is also coupled to a drive shaft of a main drive of the dressing apparatus through a planetary gear mechanism so that the brush will rotate or orbit about the drive shaft. Therefore, the dressing brush traces a complex path and its dressing action is spread over a wide surface area of the polishing cloth to produce thorough resurfacing of the polishing surface. The service life of the cloth is significantly increased and contributes to improving the overall efficiency of preparing high quality polished semiconductor wafers. For economy, the dressing apparatus can be mounted easily on a conventional polishing apparatus having a dressing facility.