Sub-ambient temperature electronic package
April 21, 2015. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent References 3481393 3868754 Heat recoverable metallic coupling Fluid cooling systems for electronic systems Integrated circuit temperature gradient and moisture regulator Method of lining inner wall surfaces of hollow articles Sealing method using heat-shrinkable film Heating apparatus for shrink tubing Apparatus for cooling integrated circuit chips Method and apparatus for producing a controlled preload on a transducer assembly by means of a composite material sleeve InventorApplicationNo. 426286 filed on 04/21/1995US Classes:257/712, With provision for cooling the housing or its contents165/80.2, Electrical component257/930, THERMOELECTRIC (E.G., PELTIER EFFECT) COOLING257/E23.082, Cooling arrangements using Peltier effect (EPO)361/704, Thermal conduction361/717For active solid state devicesExaminersPrimary: Crane, Sara W.Assistant: Ostrowski, David Attorney, Agent or FirmForeign Patent References
International ClassesH01L 023/34H01L 023/38 AbstractAn integrated circuit package having an internal cooling device. The integrated circuit package includes a thermoelectric device that operates according to the Peltier cooling effect. The thermoelectric device includes a first plate and a second plate that are thermally connected by a plurality of conducting elements. A package substrate is attached to the first plate such that a chamber is formed. The second plate is disposed within the chamber apart from the package substrate. The second plate is cooled when power is supplied to the thermoelectric device. By disposing an integrated circuit chip on the second plate and evaluating the chamber, the integrated circuit chip may be cooled to a sub-ambient temperature without internal or external condensation.Other References
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